1

Deep trenches in silicon using photoresist as a mask

Year:
1993
Language:
english
File:
PDF, 745 KB
english, 1993
2

Piezoresistive accelerometers for MCM package

Year:
2002
Language:
english
File:
PDF, 1.17 MB
english, 2002
4

Characterisation of electroplated Sn/Ag solder bumps

Year:
2006
Language:
english
File:
PDF, 876 KB
english, 2006
16

Review of CMOS image sensors

Year:
2006
Language:
english
File:
PDF, 679 KB
english, 2006
28

High density of electrodeposited Sn/Ag bumps for flip chip connection

Year:
2006
Language:
english
File:
PDF, 428 KB
english, 2006